JPS6125976Y2 - - Google Patents
Info
- Publication number
- JPS6125976Y2 JPS6125976Y2 JP1981159468U JP15946881U JPS6125976Y2 JP S6125976 Y2 JPS6125976 Y2 JP S6125976Y2 JP 1981159468 U JP1981159468 U JP 1981159468U JP 15946881 U JP15946881 U JP 15946881U JP S6125976 Y2 JPS6125976 Y2 JP S6125976Y2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- carrier
- jig
- processing
- surface plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 14
- 238000003754 machining Methods 0.000 claims description 7
- 230000033001 locomotion Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000005247 gettering Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981159468U JPS5863960U (ja) | 1981-10-26 | 1981-10-26 | 平面研削装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981159468U JPS5863960U (ja) | 1981-10-26 | 1981-10-26 | 平面研削装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5863960U JPS5863960U (ja) | 1983-04-28 |
| JPS6125976Y2 true JPS6125976Y2 (en]) | 1986-08-05 |
Family
ID=29951922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981159468U Granted JPS5863960U (ja) | 1981-10-26 | 1981-10-26 | 平面研削装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5863960U (en]) |
-
1981
- 1981-10-26 JP JP1981159468U patent/JPS5863960U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5863960U (ja) | 1983-04-28 |
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